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HDI printed circuit boards (High Density Interconnection)
Your projects require a high density of interconnections?
Our solution: HDI- printed circuit boards.
Our technical strenghts
- Microvia via-filling
- Registration of the layers with X-ray.
- Insolation through LDI (Line of 70 microns)
- Metallization ratio ≤ 1
Application types
- Calculator
- CPU card
- Usage of fine pitch components
Precautions to keep in mind
- Compliance with the installation rules
- Plating ration microvia ≤ 1
Finishing
Finishing ENIG, Sn chemical.
Materials
Materials FR4 new generation, polymide.