- Home >
- Our solutions >
- Finishing
Finishing
To accompany you on your projects, Cimulec group control many finishes. To help you in your choice, you will find below their main characteristics :
Nickel Gold (ENIG)
Characteristics :
- 5µ of nickel is placed on copper, followed by 0.08µ of gold.
- A good knowledge of the chemical process used to prevent oxidation of nickel.
Advantages/ Disadvantages:
- Good solderability.
- Very good flatness.
- Common finishing.
- Multiple brazing possible.
- Long lifespan.
- The nickel layer is not always compatible with uses high frequency.
- Too much oxidation of the nickel can lead to problems of soldering.
- High cost due to the use of gold.
Nickel - Gold Palladium (ENEPIG)
Characteristics :
- The method is identical to the ENIG plus depositing a layer of palladium from nickel and gold.
- This function is to prevent oxidation of nickel.
Advantages/ Disadvantages:
- Good solderability.
- Very good flatness.
- Multiple brazing possible.
- Long lifespan.
- More expensive than ENIG.
- Given its dissemination within 5 days is required.
HASL (Hot Air Solder Levelling)
Characteristics :
- After a first immersion, the carte is submerged in a tin-lead bath of 250 °C (482 °F). Just after immersion, hot air knife leveling the alloy surface.
Advantages/ Disadvantages:
- Good solderability.
- Cheap finishing.
- Long storage possible.
- SMD (surface-mounted device), fine cutting-point.
- Flatness (not recommended for small paths).
- Fierce temperature.
- Frail copper.
Immersion Tin)
Characteristics :
- 1 to 1.2 µ of tin is selectively placed on a copper surface.
- An inter-metallic Copper-Tin is created after aging.
This inter metallic is not compatible with the solderability.
Advantages/ Disadvantages:
- Good solderability.
- Very good flatness.
- Compatible with Press-fit.
- Quick ageing.
- Incompatible with products needing a polymerisation process
- All welding has to be done at once.
- Use of a dangerous substance (Thiourea).
SnPb reflow
Characteristics :
- Immersion of the card in an oil-bath of 210°C (410 °F).
Advantages/ Disadvantages:
- Finishing very reliable, qualified for space.
- Good solderability.
- Long storage possible.
- Flatness.
- Not recommended for varnish treatment.
HASL |
Tin |
Chemical |
ENIG |
ENEPIG |
|
|---|---|---|---|---|---|
Storage-time |
> 1 year |
< 6 months |
< 6 months |
1 year |
1 year |
Flatness |
-- |
++ |
++ |
++ |
++ |
BGA compatibility |
no |
yes |
yes |
yes |
yes |
Press fit |
++ |
+ |
+ |
- |
|
Multi soldering process |
++ |
- |
- |
+ |
+ |
Availability (short delay) |
+ |
+ |
- |
+ |
- |
Cost |
++ |
+ |
+ |
- |
- |